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100-000000323
AMD EPYC 7413 processor 2.65 GHz 128 MB L3
£690.41
Limited Stock: Only 2 available
24 cores, 48 threads, 2.65GHz base clock, 3.6GHz boost clock, 128MB L3 cache, 180W TDP
Description
Accelerate Workload Performance Data centers that require the best CPU performance, security features, and scalability count on Solution Briefs and White Papers Find the technical resources you need to learn more about AMD EPYC™. Where to Buy EPYC™️ Powered Solutions Find a partner offering AMD EPYC™ Processors and solutions. AMD Data Center Insights and Updates Sign up to receive the latest data center news and server content. AMD Infinity Guard Help minimize potential attack surfaces as software is booted, executed, and processes your critical data AMD Infinity Architecture With architecture, performance, and security leadership, our approach to processor design accelerates the pace of innovation so that you can break through years o...f data center stagnation.Specifications
Processor | |
---|---|
Processor base frequency | 2.65 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Configurable TDP-down | 165 W |
Thermal Design Power (TDP) | 180 W |
Processor cache | 128 MB |
Processor model | 7413 |
Processor threads | 48 |
Processor boost frequency | 3.6 GHz |
Component for | Server/workstation |
Processor family | AMD EPYC |
Processor cores | 24 |
Box | No |
Processor socket | Socket SP3 |
Configurable TDP-up | 200 W |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Configurable TDP-down | 165 W |
Thermal Design Power (TDP) | 180 W |
Technical details | |
---|---|
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 180 W |
Market segment | Server |
Configurable TDP-up | 200 W |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 180 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Configurable TDP-up | 200 W |
Logistics data | |
Harmonized System (HS) code | 85423119 |