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KF556S40IB-16
Kingston Technology FURY 16GB 5600MT/s DDR5 CL40 SODIMM Impact PnP
£46.44
In Stock
16GB 5600MT/s DDR5 CL40 SODIMM FURY Impact PnP
Description
Your notebook or small-form-factor machine can now experience the latest, cutting-edge memory technology with Kingston FURY™ Impact DDR5. With Intel® XMP 3.0 Certified SODIMM kit capacities of up to 64GB, Kingston FURY Impact DDR5 packs all the enhanced features of DDR5 into a slim, compact form factor. On Plug N Play* enabled modules, Kingston FURY Impact DDR5 automatically overclocks, giving your system a boost in performance without having to enable a profile. Modules featuring XMP 3.0 profiles can overclock to the highest frequency published, up to 6400MT/s, by selecting the profile in BIOS settings.Mighty DDR5 SODIMM performance
With a starting speed of 4800MT/s, DDR5 is 50% faster than DDR4 for a boost in gaming, rendering, and multitasking.
Plug N Play... automatic overclocking functionality*
Kingston FURY Impact DDR5’s PnP modules automatically overclock to the highest listed speed.
Intel® XMP 3.0 Certified
Maximise memory performance with advanced pre-optimised timings, speed and voltage for overclocking.
Low Power Consumption, Increased efficiency
Keep your system cool and efficient with Kingston FURY Impact DDR5’s low power draw.
Improved stability with on-die ECC
Maintain data integrity while hitting overclocking speeds.
Specifications
Power | |
---|---|
Memory voltage | 1.1 V |
Design | |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details | |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory | |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 40 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 28.56 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 2800 MHz |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features | |
On-Die ECC | Yes |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 40 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 28.56 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 2800 MHz |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 5600 MT/s |
Operational conditions | |
---|---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions | |
Package width | 57.2 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Width | 3.8 mm |
Depth | 69.6 mm |
Height | 30 mm |
Weight | 8.88 g |
Package weight | 26.72 g |
Packaging data | |
Package width | 57.2 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Package weight | 26.72 g |
Logistics data | |
Master (outer) case width | 196.9 mm |
Master (outer) case length | 311.2 mm |
Master (outer) case height | 61 mm |
Master (outer) case gross weight | 812.13 g |
Products per master (outer) case | 25 pc(s) |
Other features | |
Country of origin | China, Taiwan |