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KF560C30BWEAK2-32
Kingston Technology FURY Beast 32GB 6000MT/s DDR5 CL30 DIMM (Kit of 2) White RGB EXPO
£115.57
In Stock
32GB 6000MT/s DDR5 CL30 DIMM (Kit of 2) FURY Beast White RGB EXPO
Description
Kingston FURY™ Beast DDR5 RGB* lets you overclock in style on next-gen gaming platforms with cutting-edge technology. Experience the superior speed advancements of DDR5 with double the banks and double the burst length.Vibrant RGB lighting customisable with Kingston FURY CTRL™ software and patented Infrared Sync Technology™ along with the new heat spreader designs in black or white, sets you apart in and out of the game.
Kingston FURY Beast DDR5 RGB features Intel® XMP 3.0 or AMD EXPO™ options, two new DDR5 overclock specs that include customizable profiles for speeds and timings. 100% tested at speed and backed by a limited lifetime warranty.
Enhanced lighting with new heat spreader design
Game in style by customizing the black or white heat spread...ers with the smooth, stunning range of 18 RGB lighting* effects using Kingston FURY CTRL™ or the motherboard manufacturer’s software.
Patented Kingston FURY Infrared Sync Technology™
Vibrant RGB effects light in unison with Kingston’s patented Infrared Sync Technology.
Intel® XMP 3.0 Certified
Advanced pre-optimised timings, speed and voltage for overclocking performance and save new user-customisable profiles using a programmable PMIC.
AMD EXPO™ Certified
AMD’s EXtended Profiles for Overclocking.
Qualified by the world’s leading motherboard manufacturers**
Tested and trusted for your preferred motherboard so you can build with confidence.
Improved stability for overclocking
On-die ECC (ODECC) helps maintain data integrity to sustain ultimate performance.
Specifications
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Product colour | White |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | White |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 30 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Memory clock speed | 3000 MHz |
| Internal memory type | DDR5 |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Product colour | White |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 30 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 3000 MHz |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.0 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Memory data transfer rate | 6000 MT/s |
| Operational conditions | |
|---|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 121.9 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 133.4 mm |
| Height | 42.2 mm |
| Weight | 90 g |
| Package weight | 133.1 g |
| Packaging data | |
| Package width | 121.9 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 133.1 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.51 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |